Characterization of Electronic Board Material Properties Under Impact Loading

Authors

Ashok K. Ayyaswamy, University of Nevada, Las VegasFollow
Srujanbabu Sridharala, University of Nevada, Las Vegas
Mohamed Trabia, University of Nevada, Las VegasFollow
Brendan O'Toole, University of Nevada, Las VegasFollow
Qunli Liu, University of Nevada, Las VegasFollow
Mostafiz Chowdhury, US Army Research LaboratoryFollow

Document Type

Conference Proceeding

Publication Date

11-11-2008

Publication Title

Proceedings of the ASME 2007 International Mechanical Engineering Congress and Exposition: Mechanics of Solids and Structures

Publisher

ASME

Volume

10, pt. A

First page number:

531

Last page number:

538

Abstract

On-board electronics in advanced military apparatus are often subjected to severe ballistic shocks and vibrations. Safeguarding on-board electronic sensors from such transient shocks due to ballistic impact is of concern. While several studies document material characteristics of electronic boards under quasi-static and low impacts, few researchers addressed the behavior of these boards under severe impact loading. This paper presents the results of testing electronic boards under different strain rates to assess the effects of strain rates on modulus of elasticity of the boards. The results are used to suggest material models that can be used in finite element codes to accurately describe the behavior of these boards under impact loading.

Keywords

Detectors; Electronic apparatus and appliances; Electronics – Materials – Testing; Military supplies; Shock (Mechanics); Vibration

Disciplines

Electrical and Electronics | Materials Science and Engineering | Mechanics of Materials | Military and Veterans Studies

Language

English

Comments

Conference held: Seattle, Washington, USA, November 11–15, 2007

Permissions

Use Find in Your Library, contact the author, or interlibrary loan to garner a copy of the item. Publisher policy does not allow archiving the final published version. If a post-print (author's peer-reviewed manuscript) is allowed and available, or publisher policy changes, the item will be deposited.

Repository Citation

Ayyaswamy, A. K., Sridharala, S., Trabia, M., O'Toole, B., Liu, Q., Chowdhury, M. (2008). Characterization of Electronic Board Material Properties Under Impact Loading. Proceedings of the ASME 2007 International Mechanical Engineering Congress and Exposition: Mechanics of Solids and Structures, 10, pt. A 531-538. ASME.