Title

Characterization of Electronic Board Material Properties Under Impact Loading

Document Type

Conference Proceeding

Abstract

On-board electronics in advanced military apparatus are often subjected to severe ballistic shocks and vibrations. Safeguarding on-board electronic sensors from such transient shocks due to ballistic impact is of concern. While several studies document material characteristics of electronic boards under quasi-static and low impacts, few researchers addressed the behavior of these boards under severe impact loading. This paper presents the results of testing electronic boards under different strain rates to assess the effects of strain rates on modulus of elasticity of the boards. The results are used to suggest material models that can be used in finite element codes to accurately describe the behavior of these boards under impact loading.

Disciplines

Electrical and Electronics | Materials Science and Engineering | Mechanics of Materials | Military and Veterans Studies

Comments

Conference held: Seattle, Washington, USA, November 11–15, 2007

Permissions

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