Template Based nanofabrication: Mechanical Characterization of Film-substrate Interface
Document Type
Conference Proceeding
Publication Date
5-9-2005
Publisher
SPIE
First page number:
959
Last page number:
967
Abstract
This paper presents the results of investigations of thin film alumina templates fabricated on silicon and other substrates. Such templates are of significant interest for the low-cost implementation of semiconductor and metal nanostructure arrays. In addition, thin film alumina templates on silicon have the potential for nanostructure integration with silicon electronics. Formation of thin film alumina templates on silicon substrates was investigated under different fabrication conditions, and the dependence of pore morphology and pore formation rate on process parameters was evaluated. In addition, process conditions for improved pore size distribution and periodicity were determined. The template/silicon interface, important for nanostructure integration on silicon, was investigated using different techniques. Thin film alumina templates on non-silicon substrates such as glass, indium-tin-oxide-coated glass and silicon carbide were also investigated.
Keywords
Composite materials; Electronics; Fabrication; Glass; Indium; Interfaces; Manufacturing processes; Nano-fabrication; Nano-structures; Nanocomposites (Materials); Nanostructured materials; Nanostructures; Oxides; Silicon; Thin films
Disciplines
Electrical and Computer Engineering | Nanotechnology Fabrication
Language
English
Permissions
Use Find in Your Library, contact the author, or interlibrary loan to garner a copy of the item. Publisher policy does not allow archiving the final published version. If a post-print (author's peer-reviewed manuscript) is allowed and available, or publisher policy changes, the item will be deposited.
Repository Citation
Das, B.,
Singaraju, P.
(2005).
Template Based nanofabrication: Mechanical Characterization of Film-substrate Interface.
959-967.
SPIE.
Comments
From: Third International Conference on Experimental Mechanics and Third Conference of the Asian Committee on Experimental Mechanics
Sevilla, Spain | May 09, 2005