Shock Reduction for Electronic Components Within a Projectile

Authors

Vinod Chakka, University of Nevada, Las VegasFollow
Mohamed Trabia, University of Nevada, Las VegasFollow
Brendan O'Toole, University of Nevada, Las VegasFollow
Srujanbabu Sridharala, University of Nevada, Las Vegas
Samaan G. Ladkany, University of Nevada, Las VegasFollow
Mostafiz Chowdhury, US ArmyFollow

Document Type

Conference Proceeding

Publication Date

11-5-2006

Publication Title

2006 ASME International Mechanical Engineering Congress and Exposition

Publisher

ASME

First page number:

1021

Last page number:

1028

Abstract

Electronic components within a projectile are subjected to severe loads over extremely short duration. Failure of these components is likely to have negative implications to the projectile or mission. While experimental data can be helpful in understanding the failure phenomena, collecting such data is usually difficult. There are also limitations on the reliability of sensors under these circumstances. Finite element modeling (FEM) can offer a means to better understand the behavior of these components. It can also be used to design better techniques to mitigate the shocks these components are subjected to. A model of a typical projectile and the gun barrel is presented. The projectile is modified to include a payload of a one-pound mass that represents a typical electronic package, which is supported by a plate. The model, which is subjected to a realistic launch pressure-time history, includes the effects of friction between the gun barrel inner surface and the projectile. The effect of the flexibility of the gun barrel on the vibrations of the electronic package is also considered. This paper proposes using a composite plate, with carbon fibers embedded in an epoxy matrix, to reduce the shocks transmitted to the payload. A parametric study of the effects of varying the thickness of the supporting plate and the fiber volume fraction on accelerations and stresses is included.

Keywords

Electronic apparatus and appliances; Electronic components; Loads (Mechanics); Projectiles; Shock (Mechanics)

Disciplines

Applied Mechanics | Electrical and Computer Engineering | Electrical and Electronics

Language

English

Comments

From conference proceeding: ASME 2006 International Mechanical Engineering Congress and Exposition
Design Engineering and Computers and Information in Engineering, Parts A and B
Chicago, Illinois, USA, November 5 – 10, 2006

Permissions

Use Find in Your Library, contact the author, or use interlibrary loan to garner a copy of the article. Publisher copyright policy allows author to archive post-print (author’s final manuscript). When post-print is available or publisher policy changes, the article will be deposited

Repository Citation

Chakka, V., Trabia, M., O'Toole, B., Sridharala, S., Ladkany, S. G., Chowdhury, M. (2006). Shock Reduction for Electronic Components Within a Projectile. 2006 ASME International Mechanical Engineering Congress and Exposition 1021-1028. ASME.