Comparison of Analytical, Numerical, and Experimental Results For a Simplified CPU/Heatsink model

Document Type

Conference Proceeding


The behavior of a plate finned heatsink and simulated CPU were assessed using analytical and computational models, and these results were compared to data taken from an experimental model. The analytical model considered fin effects and after considering several options used a Nusselt number correlation for laminar flow over a flat plate to find the convection heat transfer coefficient and consequent maximum temperature at the base of the simulated CPU. Icepak thermal modeling software was utilized to create and solve the computational model. All three models considered only steady-state conditions. Maximum temperatures from the analytical, computational, and experimental models varied from one another by no more than 2% with respect to the mean temperature in Kelvin. Though these results are promising, they were achieved only through multiple refinements to the various models.


Computer software; Convection; Flat plates; Heat – Convection; Laminar flow; Mathematical models; Modeling; Motherboards (Microcomputers); Steady state; Temperature


Computer Engineering | Energy Systems | Hardware Systems | Heat Transfer, Combustion | Mechanical Engineering


Conference held: Seattle, Washington, USA, November 11–15, 2007


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