Particle Attrition Analysis in a High Temperature Rotating Drum
Document Type
Conference Proceeding
Publication Date
8-16-2008
Publication Title
Proceedings of 19th International Conference on Systems Engineering
Publisher
IEEE
First page number:
512
Last page number:
518
Abstract
Particle attrition is one of the important studies to be investigated as part of solid particle solar receiver design and developmental program. Two types of mechanism encountered in attrition are (a) Abrasion: wearing down by friction. Particles of much smaller size break away from the original particle. (b) Fragmentation: the breaking-away process gives rise to a number of particles of size smaller than the original one. In general, attrition takes place by an abrasive type mechanism. The attrition phenomenon is between the son particles and the fines produced. The mass of fines produced will therefore provide a means of measurement of the degree of attrition. The phenomenon of attrition in a fluidized bed is analyzed and its merits and demerits are discussed with respect to particle attrition in solar receiver, specifically at high temperature close to 1000 degC. The possible fluidized bed demerits are overcome through an appropriate design and development of high temperature (up to 1000 degC) rotating drum, and this is analyzed in this paper.
Keywords
Particles; Solar energy
Disciplines
Materials Science and Engineering | Mechanical Engineering | Oil, Gas, and Energy | Sustainability
Language
English
Permissions
Use Find in Your Library, contact the author, or use interlibrary loan to garner a copy of the article. Publisher copyright policy allows author to archive post-print (author’s final manuscript). When post-print is available or publisher policy changes, the article will be deposited
Repository Citation
Vijayarangan, B. R.,
Moujaes, S.,
Flores, M.
(2008).
Particle Attrition Analysis in a High Temperature Rotating Drum.
Proceedings of 19th International Conference on Systems Engineering
512-518.
IEEE.
Comments
Systems Engineering, 2008. ICSENG '08. 19th International Conference , 19-21 Aug. 2008, Las Vegas, NV.