Master of Science (MS)
First Committee Member
Mohamed B. Trabia
Second Committee Member
Brendan J. O'Toole
Number of Pages
On-board electronics in advanced military equipment are often subjected to severe ballistic shocks and vibrations. Impact and shock to such products can cause significant functional and physical damage. Safeguarding on-board electronic sensors from such transient shocks due to ballistic impact is of concern. While several studies document material characteristics of electronic boards under quasi-static and low impact conditions, few researchers addressed the behavior of these boards under severe impact loaDing This research presents the results of testing electronic boards under different strain rates to assess the effects of strain rates on modulus of elasticity of the boards. This work also outlines the finite element modeling methodology for these electronic components that are subjected to high acceleration loads that occur over extremely short time such as impact, gun firing and blast events. The results are used to suggest material models that can be used in finite element codes to accurately describe the impact behavior of these boards.
Board; Characterization; Electronic; Impact; Loading; Material; Properties; Under
Mechanical engineering; Materials science; Electrical engineering
University of Nevada, Las Vegas
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Ayyaswamy, Ashok Kumar, "Characterization of electronic board material properties under impact loaDing" (2007). UNLV Retrospective Theses & Dissertations. 2210.
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