A Charge-Filtration-Diffusion Model for Microvessel Permeability
Document Type
Conference Proceeding
Publication Date
2002
Publication Title
Proceedings of the 2002 IEEE Engineering in Medicine and Biology
Publisher
IEEE
Volume
1
First page number:
839
Last page number:
840
Abstract
Endothelial surface glycocalyx plays an important role in the regulation of microvessel permeability by possibly changing its charge and configuration. To investigate the mechanisms of how surface properties of the endothelial cells control the changes in microvessel permeability, we extended the charge-diffusion model developed by Fu et al. (2002) for the interendothelial cleft with a negatively charged surface glycocalyx layer, to include the filtration due to hydrostatic and oncotic pressures across the microvessel wall, as well as the electrical potential across the surface fiber layer. Based on hypotheses proposed in Curry (1994), the predictions from this charge-filtration-diffusion model provided a remarkably good agreement with experimental data for permeability of negatively charged α-lactalbumin summarized in Curry (1994) under various conditions.
Keywords
Biodiffusion; Bioelectric phenomena; Blood-vessels; Cell membranes – Electric properties; Cells – Permeability; Electrophysiology; Endothelial cells; Filtration; Glycoproteins; Haemorheology; Permeability; Physiological models
Disciplines
Biomedical Engineering and Bioengineering | Engineering | Mechanical Engineering | Molecular, Cellular, and Tissue Engineering
Language
English
Permissions
Use Find in Your Library, contact the author, or interlibrary loan to garner a copy of the item. Publisher policy does not allow archiving the final published version. If a post-print (author's peer-reviewed manuscript) is allowed and available, or publisher policy changes, the item will be deposited.
Repository Citation
Fu, B.,
Chen, B.
(2002).
A Charge-Filtration-Diffusion Model for Microvessel Permeability.
Proceedings of the 2002 IEEE Engineering in Medicine and Biology, 1
839-840.
IEEE.