"Mechanism of Creep Deformation of Alloy 230 Based on Microstructural A" by Sudin Chatterjee and Ajit K. Roy
 

Mechanism of Creep Deformation of Alloy 230 Based on Microstructural Analyses

Document Type

Article

Publication Date

11-15-2010

Publication Title

Materials Science and Engineering: A

Volume

527

Issue

29-30

First page number:

7883

Last page number:

7900

Abstract

Creep testing of Alloy 230 was performed at 750, 850 and 950 °C under applied stresses equivalent to its 10% and 25% yield strength (YS) values. The results indicate that this alloy satisfied the maximum allowable creep strain of 1% when loaded to 0.10YS level at these temperatures. Microscopic evaluations revealed the formation of second phase particles including superstructures and carbide precipitates as a function of temperature. The enhanced plastic strain at 0.25YS stress level at 950 °C was attributed to dislocation glide, subgrain formation, and recrystallization.

Keywords

Alloy 230; Creep mechanism; Deformations (Mechanics); Heat resistant alloys; Heat resistant alloys – Creep; Heat resistant alloys – Microstructure; Microscopy; Molybdenum; Nickel-chromium alloys; Temperature and stress effect; Thermal stresses; Tungsten

Disciplines

Engineering | Mechanical Engineering | Mechanics of Materials | Metallurgy

Language

English

Permissions

Use Find in Your Library, contact the author, or interlibrary loan to garner a copy of the item. Publisher policy does not allow archiving the final published version. If a post-print (author's peer-reviewed manuscript) is allowed and available, or publisher policy changes, the item will be deposited.

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